cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 1/7 BCP53L3 c y s t ek product s pecification general purpose pnp epitaxial planar transistor BCP53L3 description general purpose mainly intended for use in medium pow er industrial application and for audio amplifier output stage. features ? high collector current and low v ce(sat) ? complement to bcp56l3 ? pb-free package symbol outline BCP53L3 sot-223 b base c collector e emitter b c e absolute maximum ratings (ta=25 c) parameter symbol limits unit collecto r -b ase v o ltage v cbo -100 v collector-emitter voltage v ceo -80 v emitter-base voltage v ebo -5 v collector current(dc) i c -1 a collector current(pulse) i cp -1.5 a power dissipation @t c =25 pd 2 w junction temperature tj 150 c storage temperature tstg -55~+150 c http://
cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 2/7 BCP53L3 c y s t ek product s pecification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -100 - - v i c =-100 a bv ceo -80 - - v i c =-10ma bv ebo -5 - - v i e =-10 a i cbo - - -100 na v cb =-80v i ebo - - -100 na v eb =-5v *v ce(sat) 1 - -0.16 -0.3 v i c =-500ma, i b =-50ma *v ce(sat) 2 - - -0.6 v i c =-700ma, i b =-35ma *v be(sat) - - -1.2 v i c =-1a, i b =-50ma *v be(on) - - -1.0 v v ce =-2v, i c =-500ma *h fe 1 100 - - - v ce =-2v, i c =-5ma *h fe 2 100 - 400 - v ce =-2v, i c =-150ma *h fe 3 50 - - - v ce =-2v, i c =-500ma f t - 125 - mhz v ce =-10v, i c =-50ma, f=100mhz cob - - 10 pf v cb =-10v, i e =0a,f=1mhz *pulse test: pulse width 380 s, duty cycle 2% classification of h fe 2 rank -16 -25 range 100~250 160~400 ordering information device package shipping marking BCP53L3 sot-223 (pb-free) 2500 pcs / tape & reel ak
cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 3/7 BCP53L3 c y s t ek product s pecification typical characteristics c u rre nt g a i n vs c ol l e c t o r c urre nt 10 100 1000 1 10 1 00 100 0 10000 c o l l e c t o r c u rr e n t --- ic (ma ) c u rre n t g a i n - --h f e vce=2v vce=5v s a t ura t i on v o l t a ge vs c ol l e c t o r c urre nt 10 10 0 100 0 1000 0 1 10 100 1000 1 0000 c o l l e c t o r c urre n t - --ic (ma ) s a tu r a ti o n vo lta g e - - - ( v ) ic=10ib vcesat ic=20ib s a tu r a ti o n v o ltag e v s c o l l ecto r c u r r e n t 100 1 000 10 000 1 10 1 00 100 0 10000 c o l l e c t o r c u rr e n t --- ic (ma ) s a t u ra t i o n v o l t a g e ---(mv ) vbesat@ic=10ib o n v ol t a ge vs col l e c t o r c urre nt 100 100 0 1000 0 1 10 100 100 0 10000 c o l l e c t o r c u rre n t ---ic (ma ) o n v o l t a ge - --(mv ) vbeon@vce=2v ty p i cal c u t o f f c u r r e n t c h a r act er is tic s 10 100 1 000 02 0 4 0 6 0 8 0 1 0 0 t r a n s i t i on f re que nc y vs c o l l e c t or c urre nt 10 100 1 000 1 10 100 1000 c o l l e c t o r c u r re n t -- -ic (ma ) t r a n s i t i o n f r e qu e n c y ---ft (m h z ) co l l e c t o r ba s e v o l t a g e - - v cb( v ) c-b cutoff current---icbo(na) tj=150c
cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 4/7 BCP53L3 c y s t ek product s pecification typical characteristics(cont.) po we r de r a t i n g c u r v e 0 0.5 1 1. 5 2 2. 5 0 50 100 150 2 00 c a s e t e m p e ra t u re --- t c ( ) p o w e r d i s s i p a t i o n - -- p d (w )
cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 5/7 BCP53L3 c y s t ek product s pecification reel dimension carrier tape dimension
cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 6/7 BCP53L3 c y s t ek product s pecification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds 183 c 60-150 seconds time maintained above: ? temperature (t l ) 217 c ? time (t l ) 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cys tech electronics corp. s pec. no. : c824 l3 issued date : 20 07.03.29 revised date : 2 010.09.06 page no. : 7/7 BCP53L3 c y s t ek product s pecification sot-223 dimension *: typical 3 2 1 f b a c d e g h a1 a2 i style: pin 1.base 2.collector 3.emitter marking: 3-l ead sot - 223 pla s tic surface mou n ted packa g e cys t ek pa ckage code: l3 ak device code date code inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1142 0.1220 2.90 3.10 g 0.0551 0.0709 1.40 1.80 b 0.2638 0.2874 6.70 7.30 h 0.0098 0.0138 0.25 0.35 c 0.1299 0.1457 3.30 3.70 i 0.0008 0.0039 0.02 0.10 d 0.0236 0.0315 0.60 0.80 a1 *13 o - *13 o - e *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o f 0.2480 0.2638 6.30 6.70 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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